SPK10-0.006-AC-58

Bergquist Company
951-SPK10-006-AC58
SPK10-0.006-AC-58

Nsx:

Mô tả:
Thermal Interface Products SIL PAD, 0.006" Thickness, 1 Side Adhesive, 19.05x12.70mm, TSPK1300/K-10

Mô hình ECAD:
Tải xuống Thư viện Tải miễn phí để chuyển đổi tệp tin này cho Công cụ ECAD của bạn. Tìm hiểu thêm về Mô hình ECAD.

Có hàng: 1,208

Tồn kho:
1,208 Có thể Giao hàng Ngay
Thời gian sản xuất của nhà máy:
6 Tuần Thời gian sản xuất tại nhà máy dự kiến để có số lượng lớn hơn mức hiển thị.
Tối thiểu: 1   Nhiều: 1
Đơn giá:
$-.--
Thành tiền:
$-.--
Dự kiến Thuế quan:

Giá (USD)

Số lượng Đơn giá
Thành tiền
$0.87 $0.87
$0.767 $7.67
$0.747 $18.68
$0.727 $36.35
$0.686 $68.60
$0.647 $161.75
$0.624 $312.00
$0.601 $601.00
$0.552 $1,380.00

Đặc tính Sản phẩm Thuộc tính giá trị Chọn thuộc tính
Bergquist Company
Danh mục Sản phẩm: Sản phẩm có giao diện nhiệt
RoHS:  
Thermally Conductive Insulators
Thermal Pad
Non-standard
Silicone Elastomer
1.3 W/m-K
6 kVAC
Beige
- 60 C
+ 180 C
19.05 mm
12.7 mm
0.006 in
35 MPa
UL 94 VTM-0
K-10 / TSP K1300
Nhãn hiệu: Bergquist Company
Quốc gia Hội nghị: Not Available
Quốc gia phân phối: Not Available
Quốc gia xuất xứ: US
Loại sản phẩm: Thermal Interface Products
Số lượng Kiện Gốc: 1
Danh mục phụ: Thermal Management
Thương hiệu: Sil-Pad
Mã Bí danh: BG80158 2167648
Đơn vị Khối lượng: 80 mg
Đã tìm thấy các sản phẩm:
Để hiển thị sản phẩm tương tự, hãy chọn ít nhất một ô
Chọn ít nhất một hộp kiểm ở trên để hiển thị các sản phẩm tương tự trong danh mục này.
Các thuộc tính đã chọn: 0

                        
Shelf Life on this Product: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70 Degrees Farhenheit (21 Degrees Celsius) and 50 percent relative humidity.
Please contact a Mouser Technical Service Representative for further assistance.
5-1120-5

CNHTS:
3824999999
CAHTS:
8541900000
USHTS:
3919905060
JPHTS:
8542900006
KRHTS:
3919900000
TARIC:
8541900000
MXHTS:
3919909900
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.