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Computer-On-Modules - COM COM Express Type 6 Compact module based on Intel Celeron 4305UE 2-core processor with 2.0GHz, 2MB L2 cache, Intel UHD Graphics 610 and dual channel DDR4 2133 MT/s memory interface (formerly Whiskey Lake).

Computer-On-Modules - COM COM-HPC Client module based on Intel Core i9-14900 LGA 1700 processor with 8 P-cores 2.0GHz up to 5.4GHz Turbo and 16 E-cores 1.5GHz up to 4.3GHz Turbo 36MB Intel Smart Cache Intel UHD Graphics 770 with 32EUs Dual channel DDR5 memory interf

congatec COM-HPC Client module based on Intel Core 5 Processor 211E with 6P-cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo 20MB Intel Smart Cache Intel UHD Graphics 770 with 24EUs Dual channelDDR5 memory interface Chipset R

congatec SMARC 2.1 module with Intel Atom x6425RE quad core processor with 1.9GHz core frequency, 1.5MB cache, 16GB 3200MT/s LPDDR4x onboard memory and 64GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

congatec SMARC 2.1 module with Intel Core 3 N355 8-core processor with 1.9GHz core frequency up to 3.9GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Commercial grade temperaturerange from 0 C to 60 C.

congatec SMARC 2.1 module with Intel Atom x7433RE 4-core processor with 1.5GHz core frequency up to 3.4GHz (turbo), 16GB 4800MT/s LPDDR5 onboard memory and 64GB eMMC 5.1 onboard flash. Industrial grade temperaturerange from -40 C to 85 C.

congatec SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 2 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.

Computer-On-Modules - COM SMARC Module with NXP i.MX 9594 4-core processor. Features 4x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 4GB onboard LPDDR5 memory and 32GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.

congatec Standard heatspreader for SMARC Module conga-SMX95. All standoffs are with 2.7mm bore hole.Variant for SMARC module with Bare Die CPU Package.

Computer-On-Modules - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8645HS with 6 cores 4.3GHz up to 5.0GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 22MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temp

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.