ams OSRAM Featured Products

Chip-scale package LEDs are designed for ultra-low height applications where space is at a premium.

Improved output power and electro-optical efficiency of up to 48% across different wavelengths.

Delivers exceptional robustness, long lifetime, and high efficiency in demanding lighting apps.

Thin-film IR:6 chip technology enhances IR-based capabilities, such as AR/VR eye‑tracking systems.

Fully automotive exterior qualified LEDs featuring a small package outline.

Excellent brightness in combination with outstanding luminance and used with standard SMT processes.

Evaluates force touch and proximity use cases with flexibility to test different material types.

A low noise, high dynamic range proximity detection AFE optimized for OFS applications.

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