Wakefield Thermal ulTIMiFlux Thermal Gap Filling Pads
Wakefield Thermal ulTIMiFlux Thermal Gap Filling Pads are designed to fill large voids between a device and the heat sink. A variety of sizes, thicknesses, conductivities, and durometers are available to configure a custom thermal solution. These pads from Wakefield Thermal are halogen free and RoHS compliant.
Features
- Excellent thermal conductivity
- Natural tackiness with no need for adhesive
- Excellent compression characteristics
- Good wet-out and superb flexibility
- Excellent converting properties
- Halogen free and RoHS compliant
Related ulTIMiFlux Products
Wakefield Thermal ulTIMiFlux Thermal Material
Excellent replacement for thermal greases designed to improve thermal transfer to the heat sink
Wakefield Thermal ulTIMiflux Gap Pad Evaluation Kit
Features excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs).
Related Thermal Insulators:
Wakefield Thermal ulTIMiFlux Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
Related Thermal Phase Change Material
Wakefield Thermal ulTIMiFlux Thermal Material
Excellent replacement for thermal greases designed to improve thermal transfer to the heat sink
Related Thermal Tapes
Wakefield Thermal DST Double-Sided Adhesive Thermal Tape
Widely used to bond heat sinks to microprocessors and other power-consuming semiconductors.